Alphacool's double-sided adhesive core thermal pad can be used to cool electronic components of all kinds where it is important to dissipate heat effectively. This significantly improves the performance and durability of the components. Assembly is significantly simplified by the material's adhesive properties.

Flexible and powerful, the thermal conduction pad is reliable and effective thanks to its material composition. With its low thickness, it offers a wide range of application possibilities. It can be flexibly cut to size to meet individual requirements. Due to its adhesive nature, it is possible to mount electrical components such as DDR modules, motherboard components, or power supply units without the need for soldering.

Technical data:

• Dimensions (L x W x H): 50 x 50 x 0.25 mm
• Thermal conductivity (ASTM D5470): 1 W/mK ±10%
• Thickness (ASTM D374): 0.25 mm
• Structure: Glass fibre fabric
• Continuous operating temperature: -30 to +120 °C
• Short-term operating temperature (30 seconds): 180 °C
• Density (ASTM D792): 1.2 g/cm³
• Holding force (PSTC-7): >3000 min 180° peel strength (aluminium) (PSTC-101): >16 N / 25 mm
• Dielectric breakdown voltage: 3 KV ±10%
• Thermal impedance @10 psi (ASTM D5470): 1.26 C-in/W
• Thermal impedance @30 psi (ASTM D5470): 1.06 C-in/W
• Thermal impedance @50 psi (ASTM D5470): 1.05 C-in/W
• Colour: White.