Name: Intel Xeon processor
Brand: HPE
SKU: 18056105
Price: 709 EUR
Availability: InStock

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The Intel Xeon processor from Hewlett Packard Enterprise is a powerful and reliable solution for server and workstation applications. With a clock speed of 2 gigahertz and four processor cores, this processor delivers solid performance for demanding tasks. The processor architecture is 64-bit, allowing for efficient processing of large data volumes. It is equipped with an 8-megabyte L3 cache, further enhancing speed and efficiency in data processing. The Intel Xeon belongs to the Xeon 5000 family and utilizes a 65-nanometer lithography, providing a good balance between performance and energy consumption. With a maximum Thermal Design Power (TDP) of 50 watts, this processor is energy-efficient and well-suited for environments where power consumption and heat generation are critical. Additionally, the processor supports virtualization technologies (VT-x), making it ideal for virtualized server environments. Manufactured in Japan, the Intel Xeon processor stands for quality and reliability.

Actual product image HPE Intel Xeon processor (LGA 771, 2 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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