Name: Core I5-13500
Brand: Intel
SKU: 23620067
Price: 239.64 EUR
Availability: InStock
Rating: 4.79 (29 reviews)

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Intel

Thanks to its high clock rates and the hybrid architecture developed on the basis of Intel Alder Lake, you can enjoy maximum gaming performance with the Intel Core i5-13500, while secondary applications run seamlessly in the background. Additionally, the processor is equipped with an integrated graphics unit. Intel's powerful hybrid architecture integrates two core families into a single CPU, ensuring that everything in your gaming universe runs smoothly. Six performance cores (P-cores) are designed for high performance in single and light-thread workloads, accelerating gaming and productive tasks. Eight efficient cores (E-cores) are optimized for multithreading performance and minimize performance dips from secondary tasks. The Intel Thread Director prioritizes and manages CPU load, distributing tasks to the most suitable core for processing. Both core types can be overclocked independently.

Actual product image Intel Core I5-13500 (LGA 1700, 2.50 GHz, 14 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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