The Thermalright Helios Intel Thermal Pad is a high-performance thermal pad specifically designed for efficient heat transfer between processors and cooling systems. With a thermal conductivity of 8.5 W/m·K, it ensures effective cooling and contributes to the stability and longevity of computer components. The pad has a thickness of only 0.2 mm, making it ideal for applications where space is limited. It is available in a convenient single piece packaging and is excellent for use with various Intel CPUs. The gray color of the pad allows for discreet integration into hardware.

• High-quality thermal conductivity of 8.5 W/m·K for optimal cooling
• Thin design with only 0.2 mm thickness for space-saving applications
• Single packaging for targeted applications and easy handling.