Deepcool EX750
6.20 W/m K, 3 gPrice in EUR including VAT, plus shipping
Product details
DeepCool EX750 high performance thermal paste is designed for ultra low thermal resistance to ensure efficient heat dissipation in any scenario. DeepCool EX750 provides ultra-low thermal resistance that
maximizes heat transfer and dissipation for high-performance CPU and GPU components (desktop/laptop). The smooth consistency facilitates application and helps fill all micro-channels between surfaces to ensure excellent thermal conductivity.
| Weight | 3 g |
| Max. temperature | 250 °C |
| Item number | 20849865 |
| Manufacturer | |
| Category | |
| Manufacturer no. | R-EX750-GY030C-G-1 |
| Release date | 5/12/2022 |
| Thermal paste type | Heat sink compound |
| Thermal conductivity | 6.20 W/m K |
| Max. temperature | 250 °C |
| Density | 2.60 g/cm³ |
| Weight | 3 g |
| Length | 19 cm |
| Width | 12 cm |
| Height | 2 cm |
| Weight | 100 g |
Specifications may include unverified machine translations.
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14-day cancellation right
30-day right of return if unopenedReturn policy
30-day right of return if unopenedReturn policy